Q. Recently we observed blistering of nickel plated copper parts. The parts were plated in a sulfamate bath by our supplier. We use these parts to prepare electronics for the automotive industry. Our vendor does not have any answers to this problem. Can you help us? —D.O.
A. I would say that the copper under layer had a pit or hole that trapped some of the sulfamate plating solution during the nickel plating step. The liquid in this defect worked its way out of the pit and caused the blister you observed.
You mentioned in a follow-up email that you have observed this on two or three parts out of 1,000 parts examined. This is not a large percentage of the parts and it speaks well for your inspection process that you are able to catch these defective parts. I would suggest to your vendor that they investigate their copper plating process. Depending on the type of copper plating they are doing, this pitting may be caused by a high free cyanide (if using a cyanide-based copper plating bath) or organic contaminants.
Related Content
-
Products Finishing Reveals 2024 Qualifying Top Shops
PF reveals the qualifying shops in its annual Top Shops Benchmarking Survey — a program designed to offer shops insights into their overall performance in the industry.
-
How to Choose Between Sulfate and Chloride-Based Trivalent Chromium
There are several factors to consider when choosing between sulfate and chloride-based baths for trivalent chromium plating. Mark Schario of Columbia Chemical discusses the differences and what platers should keep in mind when evaluating options.
-
Troubleshooting Alkaline Zinc
One of the most common problems that can arise when plating with alkaline zinc is an imbalance of brightener in the solution. In this helpful Ask the Expert article, Chad Murphy of Columbia Chemical discusses how different zinc metal concentrations and brightener concentrations can impact efficiency.