Tellurium Copper Problems
Question: We are trying to plate silver over nickel on tellurium copper.
Question:
We are trying to plate silver over nickel on tellurium copper. We are having problems with peeling. When we plate beryllium copper parts we do not have this problem. Can you help us? P.S.
Answer:
Tellurium tends to have many of the same properties as beryllium. The only significant difference seems to be that tellurium copper requires a more aggressive preparation cycle. There are a number of recommended methods. One such method is to pretreat the parts in hot concentrated caustic followed by pickling in 30–60% nitric acid (v/v). Sometimes you can get by without the hot caustic step. Keep in mind that hot caustic is nasty stuff and must be thoroughly removed before going to the nitric acid dip.
Another approach is to use an acid dip prepared from phosphoric acid (38–40%), nitric acid (2%) and acetic acid (58–60%). A temperature of 160F is recommended. The nitric acid concentration tends to control the rate of oxide removal.
Because tellurium copper requires a more aggressive cycle, you may have to use the solution above for a longer period of time or at a slightly higher temperature.
Related Content
-
Advantages to Pumped Eductor Agitation
Not all agitation methods are created equally. Pumped agitation with eductor nozzles can improve process tanks and quickly show a reduction in operating costs while keeping staff safe, following environmental legislation and preventing pollution.
-
Nanotechnology Start-up Develops Gold Plating Replacement
Ag-Nano System LLC introduces a new method of electroplating based on golden silver nanoparticles aimed at replacing gold plating used in electrical circuits.
-
Possibilities From Electroplating 3D Printed Plastic Parts
Adding layers of nickel or copper to 3D printed polymer can impart desired properties such as electrical conductivity, EMI shielding, abrasion resistance and improved strength — approaching and even exceeding 3D printed metal, according to RePliForm.
