Our plating shop is having problems with plating gold components that have been nickel plated. We find that we get inconsistent results with the gold adhering to the nickel plate. This causes peeling and blistering of the gold plate.
We have adhesion problems when plating nickel over electroless nickel. The bath analysis for both solutions is within the required tolerances. We are not using a nickel strike prior to the electrolytic nickel plating step. Do you have any suggestions?
We have a problem with our EN (high-P): after two to three turnovers, we have nickel balls (about 50-100 microns) forming on our parts; after one to two more turnovers it’s OK again.
Our zinc plater is having a heck of a time with a part that is made from sintered steel. The shop does a good job with all of our non-sintered parts. Do you have any advice for solving this problem?
Which grade of nitric acid do you recommend for post-treatment of zinc-plated parts? There are three grades listed by my chemical supplier: commercial/technical, L.R. and A.R.
In the February issue, I answered a question regarding formation of excess crystals in a potassium chloride zinc plating bath. I recently received additional information from one of the plating shops regarding its problem.
At a recent party, I was asked what the difference is between “gold filled” and “gold electroplate.” I told them, but I want to verify the answer I gave them. What is the difference?
We are a decorative plating company with gold over bright nickel being one of our specialties. We continue to have problems with gold peeling from the bright nickel layer.