Lumishield Electroplating Process Improves Adhesion and Corrosion Resistance
Once Lumidize is applied, surfaces chemically bind to topcoats without phosphate or primer.
LumiShield Technologies’ Lumidize is an adhesion-strengthening aluminum electroplating process that replaces surface preparation products containing heavy metals and phosphates. Lumidize is a proprietary aqueous process that plates any conductive substrate. The resultant electroplate forms a hard barrier, improving adhesion and corrosion resistance. Once Lumidize is applied, surfaces chemically bind to topcoats without phosphate or primer. Made in the U.S., Lumidize is compatible with pulse and DC systems, and compliant with U.S. air emissions regulations.
Lumishield Technologies Inc.|412-607-8351|lumishieldtech.com
Related Content
-
Trivalent Chrome Overview
As the finishing industry begins to move away from the use of hexavalent chromium to trivalent chromium, what factors should finishers consider as they make new investments? Mark Schario, chief technology officer for Columbia Chemical offers a helpful overview of this complicated topic.
-
Advantages to Pumped Eductor Agitation
Not all agitation methods are created equally. Pumped agitation with eductor nozzles can improve process tanks and quickly show a reduction in operating costs while keeping staff safe, following environmental legislation and preventing pollution.
-
How to Choose Between Sulfate and Chloride-Based Trivalent Chromium
There are several factors to consider when choosing between sulfate and chloride-based baths for trivalent chromium plating. Mark Schario of Columbia Chemical discusses the differences and what platers should keep in mind when evaluating options.
