Lumishield Electroplating Process Improves Adhesion and Corrosion Resistance
Once Lumidize is applied, surfaces chemically bind to topcoats without phosphate or primer.
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LumiShield Technologies’ Lumidize is an adhesion-strengthening aluminum electroplating process that replaces surface preparation products containing heavy metals and phosphates. Lumidize is a proprietary aqueous process that plates any conductive substrate. The resultant electroplate forms a hard barrier, improving adhesion and corrosion resistance. Once Lumidize is applied, surfaces chemically bind to topcoats without phosphate or primer. Made in the U.S., Lumidize is compatible with pulse and DC systems, and compliant with U.S. air emissions regulations.
Lumishield Technologies Inc.|412-607-8351|lumishieldtech.com
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