Reduced Ion Electroless Nickel
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NASF Report: October 2020

This month’s NASF content includes two papers, one discussing a new electrodeposition pretreatment process and the other updating readers on ongoing research at Wayne State University.

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This month’s National Association for Surface Finishing (NASF) content takes the form of two papers. Read the descriptions and find links below:

A Novel Pretreatment Process for Direct Electrodeposition onto Aluminum Alloys

J. Xu,1 T.D. Hall,1 C. Crowley,2 S. Snyder,1 B. Skinn,1 M.E. Inman1 and E.J. Taylor1

1Faraday Technology Inc., Clayton, Ohio USA

2Fermi National Accelerator Laboratory, Batavia, Illinois, USA

This paper discusses a novel pretreatment process for direct electrodeposition nickel-phosphorus (NiP) and nickel (Ni) from commercial electrolytes onto aluminum (Al) alloy (T6061) surfaces without the need for zincate or stannate pretreatment processes. The authors compare the coatings’ properties to conventional commercially applied electroless NiP using conventional pretreatment processes. Access and print the full paper at http://gbm.media/NASF20Dec1.

NASF/AESF Foundation Research Project #121: Development of a Sustainability Metrics System and a Technical Solution Method for Sustainable Metal Finishing: 2nd Quarterly Report

Prof. Yinlun Huang, Wayne State University, Detroit, Michigan, USA

The NASF Research Board has funded a research grant at Wayne State University on sustainability in the surface finishing industry, under the direction of Professor Yinlun Huang. The objective of the work is to create a surface-finishing-specific sustainability metrics system to measure economic, environmental and social sustainability and use it to identify problems and generate a road map for sustainability performance improvement and profitability assurance in plants. The Board invites readers to contact Dr. Huang to identify plating shops willing to participate in this program. Access and print the full paper on the second quarter work at http://gbm.media/NASF20Dec2.

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