Coater Enables High-Performance Semiconductor Production

Toray Engineering Co. Ltd. (Tokyo, Japan) has developed the Treng-PLP Coater, a high-accuracy coating device for panel level packaging. The Coater enables 2.5D packaging to be applied to larger substrates. It is capable of creating detailed rewiring layers on glass substrates for use in interposers, which are a key component of integrated circuits. The Coater facilitates the production of high-performance semiconductors.

Interposers are a key component in semiconductor packaging and are traditionally made of silicon. Since interposers are square and silicon wafers are round in shape, cutting square interposers out of 300-mm-diameter, round silicon wafers inevitably results in silicon waste.

PLP technologies, which use 600-mm-square glass substrates, are seen as a potential solution to the above problems. The larger area of the glass substrate means that larger scale packages can be produced compared to what is possible with silicon wafers. Its square shape means that the entire substrate can be effectively used to create square interposers without resulting in unused substrates.

To prevent warping, Toray Engineering has developed technologies for the handling of large glass substrates, drawing on proprietary coating technologies for LCD panels, which are capable of controlling thickness with a high degree of precision.