Electroplating Method Suited for Small Components
Technic will showcase a variety of technologies for industrial and electronic finishing at Sur/Fin 2018, including its Spouted Bed Electrode (SBE), a patented method of electroplating small components such as electronic connectors, pins, chip capacitors and resistors.
Technic will showcase a variety of technologies for industrial and electronic finishing, including its Spouted Bed Electrode (SBE), a patented method of electroplating small components such as electronic connectors, pins, chip capacitors and resistors.
Also featured will be the CDP2000, a precision electroplating machine designed for high-accuracy, controlled-depth precious metal plating on loose parts (typically pins and sockets for the electronic connector industry). A range of conventional equipment from manual, wet, bench processing systems and laboratory scale production workstations to advanced multi-hoist lines and reel-to-reel, roll-to-roll and wire-plating technologies will round out the selections on display.
Finally, the company also will highlight its Alufinish aluminum anodizing products, which were introduced at Sur/Fin 2017.
Related Content
-
Possibilities From Electroplating 3D Printed Plastic Parts
Adding layers of nickel or copper to 3D printed polymer can impart desired properties such as electrical conductivity, EMI shielding, abrasion resistance and improved strength — approaching and even exceeding 3D printed metal, according to RePliForm.
-
Advantages to Pumped Eductor Agitation
Not all agitation methods are created equally. Pumped agitation with eductor nozzles can improve process tanks and quickly show a reduction in operating costs while keeping staff safe, following environmental legislation and preventing pollution.
-
Nanotechnology Start-up Develops Gold Plating Replacement
Ag-Nano System LLC introduces a new method of electroplating based on golden silver nanoparticles aimed at replacing gold plating used in electrical circuits.