Precision and Controlled Depth Electroplating
Highlights of company offerings include the Spouted Bed (SBE) for precision electroplating and the CDP2000 machine for controlled depth electroplating.
Renowned for proprietary process chemistry, equipment and controls, Technic reaffirms its industry leadership at SUR/FIN. Highlights of company offerings include the Spouted Bed (SBE) for precision electroplating and the CDP2000 machine for controlled depth electroplating.
From manual systems to advanced multi-hoist lines, Technic offers a variety of options. New products include a specialized Eco Product Line, showcasing environmentally friendly solutions and Cataphoretic Lacquers for enhanced part protection and appearance. Technic's experts will be on hand to discuss the range of chemistry as well as equipment for electronic, industrial, PCB, and decorative applications.
Related Content
-
Troubleshooting Alkaline Zinc
One of the most common problems that can arise when plating with alkaline zinc is an imbalance of brightener in the solution. In this helpful Ask the Expert article, Chad Murphy of Columbia Chemical discusses how different zinc metal concentrations and brightener concentrations can impact efficiency.
-
Advantages to Pumped Eductor Agitation
Not all agitation methods are created equally. Pumped agitation with eductor nozzles can improve process tanks and quickly show a reduction in operating costs while keeping staff safe, following environmental legislation and preventing pollution.
-
How to Maximize Nickel Plating Performance
The advantages of boric acid-free nickel plating include allowing manufacturers who utilize nickel plating to keep up the ever-changing regulatory policies and support sustainability efforts.