electronics
GAME Changers
Phoenix company APSM builds and finishes gaming devices for the casino industry, including all electronics and harnesses.
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Electrochemical Cell Geometry for Uniform Processing of Printed Circuit Boards
Faraday Technology has developed and patented an electrochemical cell geometry based on a novel flow mechanism for uniform processing (metallization or electroetching) of printed circuit boards.
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Rockwell Collins Gets $1M Defense Contract For Reducing Growth Of "Tin Whiskers"
See the VIDEO of how microscopic metal fibers can form on lead-free metal coatings and cause short circuits in electronics
WatchFungus-Resistant Topcoat
We are using a mil spec polyurethane topcoat, MIL-PRF-85285, on an electronics housing, and I am trying to find a reference indicating that this topcoat is fungus-resistant.
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Investigation of Tin Whisker Formation
Immersion tin and lead-free hot air solder leveling (HASL) coatings based on SnCu or SnAgCu alloys are widely used as surface finish materials for printed circuit boards (PCB). These coatings prevent the underlying copper from corrosion and preserve its solderability during lead-free assembly processes and for a long storage life of PCBs.
Read More2020 Vision: Vacuum Coatings
Across all industries – medical device, automotive, electronics, military and aerospace ‑ electronic components are becoming smaller in size, but more complex in application capabilities.
Read MoreFinishing Chemical Business Could Hit $8B by 2015
A new report out suggests that sales of metal finishing chemicals could hit $8 billion globally by 2015, driven by electronics and electrical, motor vehicle equipment and the aerospace industries.
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Validation of New Generation Tooling Concept for Electroplating of Copper on Printed Circuit Boards
A dynamically software controlled electroplating tooling concept has been developed to compensate the pattern dependence of the deposited layer thickness on different substrates. In this paper a validation of this new tooling concept on industry relevant printed circuit boards is presented. Simulations are compared with experimental results as obtained in a prototype electroplating cell. A quantitative improvement of the plating thickness uniformity between a standard electroplating cell and the advanced tooling approach is given. The influence of the conductivity of the electrolyte on the deposit distribution is studied and indicates a way to obtain a significant improvement in uniformity.
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