Articles

Pollution Control 1 Apr 2014

Hospitality Suites at ECOAT14 Will Draw Big Crowds

More than a dozen hospitality suites and over a dozen more table-top exhibitors highlight what will be on display at ECOAT14

construction 28 Mar 2014

PPG recognized as John Deere Supplier of the Year

PPG selected in appreciation of its dedication to providing products and services of outstanding quality, its risk-minimizing Secure Launch Excellence process and its commitment to continuous improvement.

masking 27 Mar 2014

Luvata's David Myers Elected President of Electrocoat Association

Director of Manufacturing/Technology returning as president for a third term

Electroplating 26 Mar 2014

Duralar Establishes U.S. Headquarters in Tucson

Italian manufacturer of ultra-hard coating will establish its U.S. headquarters in the Tucson region of Arizona.

Pollution Control 25 Mar 2014

Electrocoat Association Presents Brewer, Best End-User Awards

Award presented since 1990 to recognize individuals who have made outstanding contributions to the field of electrocoating in the categories of technology, application and promotion.

Anodizing 24 Mar 2014

Advanced Technical Finishing Receives Nadcap Accreditation

Receives accreditation for MIL-A-8625 Anodic Coatings for Aluminum and Aluminum Alloys, and MIL-DT-5541 Chemical Conversion Coatings on Aluminum and Aluminum Alloys.

nasf 20 Mar 2014

NASF Washington Forum is April 8-10

Join with fellow industry leaders for a day and half briefing and the opportunity to meet with our lawmakers on Capitol Hill.

medical 18 Mar 2014

The Finishing Company Acquires Jet Finishers, Inc.

Jet Finishers brings expertise in powder coating, wet coating, silk screening and masking services that meet the exacting requirements of the military, medical and telecommunications industries.

masking 17 Mar 2014

Making the Medical Grade for Gold Plating

Gold plating delicate and micro parts involves more than just the gold plating process—extending to cleaning, rinsing, drying and inspecting the deposits on these difficult components, as well.

Anodizing 14 Mar 2014

Enthone Opens Wafer Level Packaging Applications Laboratory

Laboratory will deliver customer-driven solutions to the dynamic wafer fabrication marketplace; includes electroplating processes for bump wafer, through silicon via, copper redistribution layer and copper post applications.