research
Current Distribution on Microprofiles - The 14th William Blum Lecture - Part 1
This article is the first of four parts of a re-publication of the 14th William Blum Lecture, presented at the 60th AES Annual Convention in Cleveland, on June 18, 1973. Dr. Otto Kardos gives a comprehensive discussion of how the deposit forms on surface textures, and how leveling and brightness are achieved.
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Polarization - The 13th William Blum Lecture
This paper is a re-publication of the 13th William Blum Lecture, presented at the 59th AES Annual Convention in Cleveland, Ohio, on June 19, 1972. The theory of electrochemical polarization and its relation to what is seen in the plating tank were discussed.
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Electroplating of Carbon Nanotube Yarns and Tapes with Five Metals
Carbon nanotube (CNT) tapes and yarns can reduce the weight of industrial cables for aviation and space by substituting for copper. In order to attach CNTs to connectors, one high-reliability method of attachment is soldering, which is difficult; however it can be facilitated by electroplating. In this study, CNT tapes and yarns were plated with Cu, Ag, Ni, Sn and Au.
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Some Practical and Theoretical Considerations of Corrosion and the Role of Chromium - The 12th William Blum Lecture
This paper is a re-publication of the 12th William Blum Lecture, presented at the 58th AES Annual Convention in Buffalo, New York, on June 14, 1971. The corrosion of plated coatings under varying environmental conditions, including the effect of polarity, porosity, combination of plate, as well as thickness and other factors on the durability of the plated product is covered.
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Thin Multilayer Palladium Coatings for Semiconductor Packaging Applications Part I: Solderability
The 1996 AES Gold Medal Award was given to I.V. Kadija and his co-workers for the Best Paper appearing in Plating and Surface Finishing in 1995. Their work dealt with the use of palladium in electronics finishing in the 1990s. This paper covered the evaluation of such finishes for solderability.
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Electrochemical Assessment of Sn-Pb Solderability
The 1991 AES Gold Medal Award was given to D.M. Tench and D.P. Anderson for the Best Paper appearing in Plating and Surface Finishing in 1990. Their work dealt with a very important concern in electronics finishing in the 1990s - testing for solderability and relating it to real world performance.
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Application of Dynamic Impedance Measurements for Adsorbed Plating Additives
The 1986 AES Gold Medal Award was given to J.C. Farmer and H.R. (Rudy) Johnson for the Best Paper appearing in Plating and Surface Finishing in 1985. Their work presents important work on electrochemical impedance measurements, then a new technique in analyzing how plating baths and their additives work.
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Simultaneous Thickness and Electrochemical Potential Determination of Individual Layers in Multilayer Nickel Deposits
The 1981 AES Gold Medal Award was given to Ed Harbulak for the Best Paper appearing in Plating and Surface Finishing in 1980. His work involved the development of the well-known STEP test, a method for evaluating the performance of decorative Cu-Ni-Cr, measuring the electrochemical potential of nickel multilayers with a modified version of the venerable Kocour thickness tester.
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The Behavior of Intermetallic Compounds in Aluminum during Sulfuric Acid Anodizing Part 2: Al-Cu, Al-Mg, Al-Si, Al-Ti, Al-Fe-Si, Al-Zn-Mg Alloys
The 1971 Carl E. Huessner Gold Medal Award was given to J. Cote and co-workers for the Best Paper appearing in Plating or the AES Technical Proceedings in 1970. Actually a two-part paper beginning in 1969, the second installment of the paper from 1970 is republished here in a series on the AES/AESF/NASF Best Paper Awards. Their work presents very important work on how the anodizing process reacts with the other materials alloyed in with commercial aluminum grades.
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The Behavior of Intermetallic Compounds in Aluminum during Sulfuric Acid Anodizing, Part 1: Al-Mn, Al-Fe, Al-Mg2Si, Al-Cr Alloys
The 1971 Carl E. Huessner Gold Medal Award was given to J. Cote and co-workers for the Best Paper appearing in Plating or the AES Technical Proceedings in 1970. Actually a two-part paper beginning in 1969, the first installment of the paper is republished here in a series on the AES/AESF/NASF Best Paper Awards. Their work presents very important work on how the anodizing process reacts with the other materials alloyed in with commercial aluminum grades.
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